Michael A. Tharp PE                                                                         

 Project 2u  -  Thermal Modeling Summary

 

Modeling Assumptions

 

·      Conditions of 35 Deg C Ambient Air  at  Sea Level

 

 

 

 

 

 

 

 

 

 

 

 Updated Model Results- Second Pass

 

For the baseline configuration thermal model the predicted XEON component case temperatures are under the Intel 72 C case temperature maximum design limit. Predicted maximum temperatures for two processors after model mesh refinements have been

reduced from the first pass estimate of 71 C to 65 C for a 35 C ambient inlet air temperature.

The 60 mm processor fan operating point is 14.9 CFM (no heat sink shroud)

The three 80 mm fans operating points are now at approximately 32  CFM each. 

Flow rate through the entire system inlet and exit grills is 95 CFM at a system pressure drop of 0.458 inches of water.

 

 

Conclusion

 

The number of fans, system air flow, and heat sinks provide adequate cooling for the design conditions modeled. There are no major thermal management issues revealed in the first pass system thermal model for the proposed mother board design layout.

 

 

 

 

 

Figure 1.     Cad and Model Component Layout

 

 

 

 

Figure 2.   ICEPAK THERMAL MODEL

 

 

Table 1.   Maximum Predicted Temperatures for  Components

 

    Xeon 3.6 GHZ       64.94 C  

    Xeon 3.6 GHZ.1    65.15 C  

    Anvik              111 C    

    Anvik.1           114.1 C  

    Anvik.2           113.4 C  

    Anvik.3           110.4 C  

    Anvik.4           106.1 C  

    BCM5823           87.93 C  

    BCM5823.1         77.7 C  

    MCH               68.71 C  

    PXH.1             81.12 C  

    PXH.1.1           67.96 C  

    PXH               64.06 C      

    DDR_CCA       85.08 C  

    DDR               77.01 C  

    DDR.1             79.26 C  

    DDR.2             81.1 C   

    DDR.3             82.65 C  

    DDR.4             83.89 C  

    DDR.5             84.75 C  

    DDR.6             85.1 C   

    DDR.7             85.02 C  

    DDR.8             84.11 C  

    DDRs              77.13 C  

    DDRs.1            79.35 C  

    DDRs.2            81.19 C  

    DDRs.3            82.73 C  

    DDRs.4            83.92 C  

    DDRs.5            84.65 C  

    DDRs.6            85.04 C  

    DDRs.7            84.89 C  

    DDRs.8            83.9 C   

    DDR_CCA.1    88.04 C  

    DDR.1.1           80.3 C   

    DDR.2.1           82.22 C  

    DDR.3.1           83.96 C  

    DDR.4.1           85.51 C  

    DDR.5.1           86.75 C  

    DDR.6.1           87.68 C  

    DDR.7.1           88.06 C  

    DDR.8.1           87.58 C  

    DDR.9             78.11 C  

    DDRs.1.1          80.23 C  

    DDRs.2.1          82.15 C  

    DDRs.3.1          83.89 C  

    DDRs.4.1          85.43 C  

    DDRs.5.1          86.67 C  

    DDRs.6.1          87.62 C  

    DDRs.7.1          88 C     

    DDRs.8.1          87.52 C  

    DDRs.9            78.05 C  

    DDR_CCA.2     88.21 C  

    DDR.1.2           80.43 C  

    DDR.2.2           82.37 C  

    DDR.3.2           84.11 C  

    DDR.4.2           85.62 C  

    DDR.5.2           86.83 C  

    DDR.6.2           87.79 C  

    DDR.7.2           88.21 C  

  

Table 1. Predicted Temperatures for  Components( Continued.)

 

 

    DDR.8.2           87.77 C  

    DDR.10            78.21 C  

    DDRs.1.2          80.44 C  

    DDRs.2.2          82.39 C  

    DDRs.3.2          84.13 C  

    DDRs.4.2          85.65 C  

    DDRs.5.2          86.87 C  

    DDRs.6.2          87.82 C  

    DDRs.7.2          88.23 C  

    DDRs.8.2          87.79 C  

    DDRs.10           78.21 C  

    DDR_CCA.3      86.36 C  

    DDR.1.3           79.45 C  

    DDR.2.3           81.2 C   

    DDR.3.3           82.71 C  

    DDR.4.3           83.97 C  

    DDR.5.3           84.92 C  

    DDR.6.3           85.45 C  

    DDR.7.3           85.49 C  

    DDR.8.3           84.67 C  

    DDR.11            77.37 C  

     DDRs.1.3        79.34 C  

    DDRs.2.3          81.11 C  

    DDRs.3.3          82.66 C  

    DDRs.4.3          83.95 C  

    DDRs.5.3          84.89 C  

    DDRs.6.3          85.54 C  

    DDRs.7.3          85.63 C  

    DDRs.8.3          84.88 C  

    DDRs.11           77.22 C  

 

 

 

 

Table 2.    Fan Operating Points

 

Fan Operating Points:

 

    80mmfan.1         Volume flow = 1.492e-002 m3/s, pressure rise = 114.06250970495 N/m2

    80mmfan.2.1       Volume flow = 1.506e-002 m3/s, pressure rise = 113.15651932065 N/m2

    80mmfan.2         Volume flow = 1.498e-002 m3/s, pressure rise = 113.7114823827 N/m2

 

    60mmfan           Volume flow = 7.059e-003 m3/s, pressure rise = 17.344809186702 N/m2

    60mmfan.1         Volume flow = 7.447e-003 m3/s, pressure rise = 15.835070226611 N/m2

 

 

 

  Table 3.   Model Heat Load Input for Objects with Power Specified:

 

 

    Object            Specified   Calculated    

    Anvik             2.61 W    2.61 W        

    Anvik.1           2.61 W    2.61 W        

    Anvik.2           2.61 W    2.61 W        

    Anvik.3           2.61 W    2.61 W        

    Anvik.4           2.61 W    2.61 W        

    BCM5823        0.9 W     0.9003 W      

    BCM5823.1      0.9 W     0.9002 W      

    DDR               0.5093 W  0.5093 W      

    DDR.1             0.5093 W  0.5094 W      

    DDR.2             0.5093 W  0.5094 W      

    DDR.3             0.5093 W  0.5093 W      

    DDR.4             0.5093 W  0.5095 W      

    DDR.5             0.5093 W  0.5094 W      

    DDR.6             0.5093 W  0.5094 W      

    DDR.7             0.5093 W  0.5094 W      

    DDR.8             0.5093 W  0.5094 W      

    DDRs              0.5093 W  0.5092 W      

    DDRs.1            0.5093 W  0.5092 W      

    DDRs.2            0.5093 W  0.5093 W      

    DDRs.3            0.5093 W  0.5094 W      

    DDRs.4            0.5093 W  0.5093 W      

    DDRs.5            0.5093 W  0.5094 W      

    DDRs.6            0.5093 W  0.5093 W      

    DDRs.7            0.5093 W  0.5093 W      

    DDRs.8            0.5093 W  0.5093 W      

    DDR.1.1           0.5093 W  0.5093 W      

    DDR.2.1           0.5093 W  0.5093 W      

    DDR.3.1           0.5093 W  0.5092 W      

    DDR.4.1           0.5093 W  0.5092 W      

    DDR.5.1           0.5093 W  0.5093 W      

    DDR.6.1           0.5093 W  0.5092 W      

    DDR.7.1           0.5093 W  0.5092 W      

    DDR.8.1           0.5093 W  0.5093 W      

    DDR.9             0.5093 W  0.5092 W      

    DDRs.1.1          0.5093 W  0.5093 W      

    DDRs.2.1          0.5093 W  0.5093 W      

    DDRs.3.1          0.5093 W  0.5093 W      

    DDRs.4.1          0.5093 W  0.5094 W      

    DDRs.5.1          0.5093 W  0.5093 W      

    DDRs.6.1          0.5093 W  0.5093 W      

    DDRs.7.1          0.5093 W  0.5093 W      

    DDRs.8.1          0.5093 W  0.5093 W      

    DDRs.9            0.5093 W  0.5093 W      

    DDR.1.2           0.5093 W  0.5093 W      

    DDR.2.2           0.5093 W  0.5094 W      

    DDR.3.2           0.5093 W  0.5093 W      

    DDR.4.2           0.5093 W  0.5093 W      

    DDR.5.2           0.5093 W  0.5094 W      

    DDR.6.2           0.5093 W  0.5093 W      

    DDR.7.2           0.5093 W  0.5094 W      

    DDR.8.2           0.5093 W  0.5094 W      

    DDR.10            0.5093 W  0.5093 W      

    DDRs.1.2          0.5093 W  0.5093 W      

    DDRs.2.2          0.5093 W  0.5094 W      

    DDRs.3.2          0.5093 W  0.5093 W      

    DDRs.4.2          0.5093 W  0.5093 W      

    DDRs.5.2          0.5093 W  0.5093 W      

   Table 3.  Model Heat Load Input ( Continued)

 

    DDRs.6.2          0.5093 W  0.5093 W      

    DDRs.7.2          0.5093 W  0.5092 W      

    DDRs.8.2          0.5093 W  0.5093 W      

    DDRs.10           0.5093 W  0.5093 W      

    DDR.1.3           0.5093 W  0.5092 W       

    DDR.2.3           0.5093 W  0.5093 W      

    DDR.3.3           0.5093 W  0.5093 W      

    DDR.4.3           0.5093 W  0.5093 W      

    DDR.5.3           0.5093 W  0.5093 W      

    DDR.6.3           0.5093 W  0.5092 W      

    DDR.7.3           0.5093 W  0.5092 W      

    DDR.8.3           0.5093 W  0.5092 W      

    DDR.11            0.5093 W  0.5092 W      

    DDRs.1.3          0.5093 W  0.5093 W      

    DDRs.2.3          0.5093 W  0.5094 W      

    DDRs.3.3          0.5093 W  0.5093 W      

    DDRs.4.3          0.5093 W  0.5093 W      

    DDRs.5.3          0.5093 W  0.5093 W      

    DDRs.6.3          0.5093 W  0.5094 W      

    DDRs.7.3          0.5093 W  0.5093 W      

    DDRs.8.3          0.5093 W  0.5094 W       

    DDRs.11           0.5093 W  0.5093 W      

    MCH                9.7 W     9.7 W         

    PXH.1              8.1 W     8.1 W         

    PXH.1.1           8.1 W     8.1 W         

    PXH                 8.1 W     8.1 W

       

    Unformly Spread on Mother_Board      123.5 W   123.5 W       

 

    PCI_FULL_CCA2     14 W      14 W          

    PCI_Full_CCA         14 W      14 W          

    Xeon 3.6 GHZ       103.0     103 W         

    Xeon 3.6 GHZ.1    103.0     103 W    

 

    

  Overall Totals:

    Total power = 443 W

 

 

Figure 3.   Air Velocity Across Motherboard

 

 

 

 

Figure4.    Air Temperature Rise Across Motherboard

 

 

 

 

 

Figure 3.   Motherboard Device Temperatures